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WPG Quanding Group has launched a TWS earphone solution based on Qualcomm products
Date:August 21, 2025    Views:31

Source: WPG Author: WPG
    On April 15, 2025, WLS Holdings, an international leading semiconductor component distributor dedicated to the Asia-Pacific market, announced that its subsidiary Quandin has launched a TWS earphone solution based on the Qualcomm Snapdragon S7+ Sound Gen 1 platform.

Illustration 1- Physical image of the TWS earphone solution based on Qualcomm products by WPG
    In recent years, TWS headphones have rapidly become an important part of the audio equipment market due to their features such as wireless connection, portability and high sound quality, and have gradually replaced traditional wired headphones to become the mainstream choice of consumers. Meanwhile, with the continuous maturation of Bluetooth technology, chip technology and sensor technology, the market size of TWS headphones has been continuously expanding. According to relevant data, the global shipment volume of TWS headphones in the first three quarters of 2024 was approximately 257 million units, among which the shipment volume in the third quarter reached 92 million units, achieving a year-on-year growth of 15%, demonstrating huge development potential. Against this background, Wlian Da Quan Ding has launched a TWS headphone solution based on the Qualcomm Snapdragon S7+ Sound Gen 1 platform, combining high performance, low-power computing, end-side AI and advanced connection capabilities, providing strong support for manufacturers to rapidly develop differentiated products.

Illustration 2- Scene application diagram of the TWS earphone solution based on Qualcomm products by WPG Quandin
    The S7+ Gen 1 is the first audio platform that supports Qualcomm's Extended Personal Local Area Network (XPAN) technology and ultra-low power WiFi connection. It can extend the audio transmission distance in homes, buildings or campuses, and support lossless music quality up to 192kHz, bringing users an unprecedented auditory enjoyment and audio experience.
    he S7+ Gen 1 platform is jointly constructed by two ics, QCC7226 and QCP7321. Among them, QCC7226 serves as the main control chip, responsible for running user applications, Bluetooth protocol processing, DSP audio data processing, and the operation of the AI algorithm platform. The QCP7321, on the other hand, serves as a coprocessor, specifically providing WiFi transmission functionality and transmitting and receiving data with the main control chip via the SPI interface. In terms of performance, the computing power of the S7 Pro Gen 1 is six times that of the previous generation platform, and its AI performance is nearly 100 times that of the previous generation platform. It can bring a brand-new level of ultra-flagship performance with low power consumption.

Figure 3- Block diagram of the TWS earphone solution based on Qualcomm products by WPG
    This time, the TWS earphone solution launched by WTC deeply integrates Qualcomm's technological advantages. It not only meets users' core demands for high-definition sound quality, long battery life, and low latency, but also achieves a more intelligent interaction experience and personalized functions through innovative design ideas, further expanding the application scenarios and boundaries of TWS earphones.

Core technological advantages:
    Fourth-generation ANC noise cancellation
    Seamless switching of Bluetooth and WiFi links, XPAN supports full house coverage.
    Hi-res audio, supporting lossless audio96k;
    AI algorithm enhancement function
    Ultra-low power consumption design.


Scheme Specification:
    Multi-core collaboration, processing doubling:
    It adopts the Arm Cortex-M55 core with a main frequency of 1x300MHz and supports FPU.
    The sensor has an Arm Cortex-M4F core with a main frequency of 1X200MHz and supports FPU.
    Artificial Intelligence: Qualcomm eNPU 64 GOPS DSP: 2×500MHz + 1×250MHz.
    WiFi specification:
    1×1 dual-band 2.4/5 GHz, supporting 802.11a/b/g/n standards;
    The data transmission rate of 11n MCS3 HT20 up to 28.9Mbps.
    Support IPv4/IPv6, TCP, UDP and TLS 9;
    Built-in 128Mb FLASH;
    Support Bluetooth coexistence;
    Support USB high-speed (480Mbps) devices;
    The software offers a variety of combination configurations to flexibly build Bluetooth audio products of various forms.


Regarding WPG Holdings:
    WPG Holdings is an internationally leading semiconductor component distributor dedicated to the Asia-Pacific market. Founded in 2005, it is celebrating its 20th anniversary this year. Its headquarters is located in Taipei. It owns Shiping, Pinjia, Quanta and Youshang, with approximately 5,000 employees. It represents over 250 product suppliers and has 69 service locations worldwide. The turnover in 2024 reached NT $880.55 billion. WPG has established an industrial holding platform, focusing on international operation scale and local flexibility. It has long been deeply engaged in the Asia-Pacific market, with the vision of being "the preferred choice for industries and the benchmark for distribution channels". It fully implements the core values of "teamwork, integrity, professionalism, and efficiency", and has been awarded the "Global Distributor Excellence Award" for 24 consecutive years. At the same time, it is continuously committed to strengthening ESG sustainable development. It has received international recognition for three consecutive years and has been honored with an A-level MSCI ESG rating. Facing the new manufacturing trend, WumUN is committed to transforming into a Data-Driven enterprise, establishing an online digital platform - "Dada Network", and advocating the intelligent Logistics Service (LaaS, Logistics as a Service) model to assist customers in jointly facing the challenges of intelligent manufacturing. Starting from good intentions, WPG builds trust through technology, and takes "Co-creating partner value and achieving the future" as its corporate mission. It hopes to jointly build a competitive and cooperative ecosystem with industry "Allies".




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