Source: Green grain
    March 11, 2025, Hong Kong - China's leading semiconductor bonding technology enterprise Qinghe Crystal Semiconductor Technology (Group) Co., LTD. (hereinafter referred to as "Qinghe Crystal") announced the official launch of the world's first C2W&W2W dual-mode hybrid bonding equipment SAB8210CWW. As a provider of advanced semiconductor bonding technology and solutions, this launch marks another important breakthrough for the company in the field of technological innovation.

    The new hybrid bonding device SAB8210CWW, which has the advantages of multi-size wafer compatibility, superior chip processing power and compatibility with different alignment methods, can help customers reduce equipment investment expenditure, footprint and significantly shorten the R & D to mass production cycle. Provides extensive support for memory such as Micro-LED, NAND/DRAM/HBM, stacked integrated circuits (SIC) and system-on-chip (SoC).

In the post-Moore era, mixed bond synthesis became the mainstream
    Since Moore's Law was proposed, the chip industry has long followed its development. But in recent years, limited by silicon materials and semiconductor devices, chip makers have struggled to continue shrinking transistor sizes. Advanced packaging has thus become an effective means of improving chip performance, as exemplified by the rise of TSMC CoWoS and HBM. Hybrid bond cooperation is a key technology for advanced packaging to achieve metal-metal and oxide-oxide face to face stacking with high precision, improving chip performance. W2W hybrid bonding has been applied in many fields, and C2W hybrid bonding is also rising rapidly, becoming the mainstream technology of heterogeneous integration. However, there are challenges in the implementation of hybrid bonding technology, such as bonding accuracy and C2W bonding efficiency, which put forward higher requirements for related equipment and promote continuous innovation in the industry.

SAB8210CWW equipment: a master of technological innovation
    Qinghe Jingyuan is committed to providing high-precision, stable process and cost-effective bonding equipment and solutions for the global semiconductor industry chain. With deep accumulation in high-end bonding equipment R & D and manufacturing and precision bonding technology, the company has launched the world's first C2W&W2W dual-mode hybrid bonding equipment SAB8210CWW. Show the technical strength incisively and vividly.

Specifically, the SAB8210CWW offers several advantages:
    l Dual-mode process integration: The equipment adopts a highly flexible modular design and supports C2W and W2W dual-mode hybrid bonding to achieve seamless adaptation to R&D and production needs and improve equipment utilization.
    l Multi-size compatibility: The device is compatible with 8-inch and 12-inch wafers, with quick switching through replacement parts, providing greater flexibility to meet the bonding needs of different sizes of wafers.
    Super chip processing power: The device can handle ultra-thin chips with thickness as thin as 35μm, while having full-size compatibility, from 0.5×0.5mm to 50×50mm chips can be processed to ensure production yield and reliability.
    l Compatible with different alignment methods: provides two alignment methods: inter-chip coaxial and infrared penetration, the alignment accuracy is better than ±300nm (coaxial) and ±100nm (infrared), to cope with different sizes and materials of the chip.
    Innovative bonding method: Through the innovation of bonding method, the risk of particle pollution is reduced to the greatest extent and high yield bonding is achieved.
    High precision and high efficiency: C2W and W2W bonding technology achieves ±30nm alignment accuracy and ±100nm bonding accuracy, and C2W single bonding head UPH up to 1000 pieces/hour. Intelligent offset compensation: Equipped with high-precision and high-throughput detection module and built-in algorithm to achieve negative feedback offset compensation to ensure the stability and consistency of bonding accuracy.
    With SAB 82CWW series as the starting point, Qinghe Crystal will continue to deepen the advanced bonding technology, increase research and development investment, launch more products to meet customer needs, and join hands with global partners to promote semiconductor heterogeneous integration technology to a new height.