Source: Renesas Electronics Author: Renesas Electronics
    Renesas' first automotive class Bluetooth Low Energy SoC DA14533
    Delivers industry-leading low power consumption, small size and system cost effectiveness
    Beijing, China, March 25, 2025 - Renesas Electronics (TSE: 6723), a global semiconductor solutions provider, today announced the launch of its new, industry-leading Bluetooth chip, the DA14533. The chip combines RF transceivers, Arm? The M0+ microcontroller, memory, peripherals and security functions are integrated in a compact system-on-chip (SoC) design. As Renesas Bluetooth Low Energy? The first in a family of SoC products to be certified by vehicle regulations, the DA14533 features advanced power management capabilities that simplify system integration and reduce power consumption. With the certified Bluetooth Core Specification 5.3 software stack and extended temperature support, developers can quickly develop projects for diverse applications including tire pressure monitoring, keyless access, wireless sensors and battery management systems.
    Building on Renesas' leading position in Bluetooth Low Energy SOCs (SmartBond Tiny family of products) and industry-leading low power technology, the new DA14533 incorporates the industry's most advanced power management capabilities: The integrated DC-DC step-down converter is built in to precisely adjust the output voltage according to system requirements; In the working state, the system power consumption is significantly lower than that of similar products in the market, only 3.1mA in transmission, and 2.5mA in reception; In sleep mode, the current is as low as 500nA. These power management and energy saving features help significantly extend the life of small battery powered systems and easily meet the demanding power requirements of tire pressure monitoring system task configurations.
    AEC-Q100 certified with the latest safety features
    The DA14533's designation as AEC-Q100 Level 2 compliant means it has been rigorously tested to ensure superior quality and reliability in extreme on-board environments. In addition, the extended temperature range (-40 to +105°C) further guarantees reliable performance under harsh conditions, making it ideal for systems with high requirements for stability and durability in automotive, industrial and other fields. The product complies with Bluetooth Core Specification 5.3 and contains the latest security features to protect connected devices from a variety of threats.
    Chandana Pairla, VP of Connectivity Solutions Division at Renesas, said: "Our SmartBond Tiny SoC product family has achieved remarkable success in the industrial market, with more than 100 million units shipped to date. "This new vehicle-scale product will enable a new generation of battery-powered automotive and industrial systems to unlock the next level of Bluetooth low energy applications, fully meeting the stringent requirements of these applications for high energy efficiency, small size and wider temperature adaptability."

Reduce BOM, reduce costs and simplify development
    Similar to other Bluetooth low energy SoC devices in the SmartBond Tiny family, the DA14533 requires only six external components, providing a best-in-class engineering bill of Materials (eBOM).
    A single external crystal oscillator (XTAL) is used for both work and sleep mode, eliminating the need for a separate oscillator for sleep mode. The ultra-compact design in the WFFCQFN 22-pin 3.5mm x 3.5mm package makes it the smallest car-scale low-power Bluetooth SoC on the market. Thanks to its compact design and simplified eBOM, the product can be seamlessly integrated into space-constrained systems, reducing overall system costs and reducing time to market for customers.

Key features of DA14533
    Arm Cortex-M0+ microcontroller: as a standalone application processor or data pump in host systems;
    64KB RAM and 12KB disposable programmable (OTP) memory;
    2.4GHz RF transceiver;
    Integrated IQ Buck DC-DC converter;
    External SPI flash memory;
    Single XTAL operation (single crystal oscillator);
    Certified Bluetooth Core specification 5.3 Software stack;
    AEC-Q100 Level 2 certification for a wide operating temperature range (-40 to +105°C);
    WFFCQFN 22 pin 3.5mm x 3.5mm package.

Successful product portfolio
    Renesas combines this new Bluetooth Low Energy SoC with the R-Car H3/M3/E3 SoC, PMIC and timing devices to offer a "portfolio of success" solution that includes a "tire pressure monitoring system." Renesas' Portfolio of successful products relies on compatible devices that work seamlessly together, coupled with a technologically proven system architecture that results in optimized, low-risk designs and faster time-to-market. Based on the various products in its product lineup, Renesas has now launched more than 400 "Success portfolios" designed to help users drive the design process and accelerate the time to market. For more information, please visit renesas.com/win.

Supply information
    The DA14533 is now available with Bluetooth Low Energy SoC Development Kit Pro. The kit includes motherboard, subboard and cable to facilitate application software development; Among them, the daughter board can also be purchased separately to simplify development. Also see the blog about the new product. For more information about Renesas Bluetooth Low Energy solutions, please visit: Bluetooth Low Energy | Renesas.

About Renesas Electronics
    Renesas Electronics (TSE: 6723), technology makes life easier and is committed to building a safer, smarter and more sustainable future. As a global microcontroller provider, Renesas combines expertise in embedded processing, analog, power and connectivity to provide complete semiconductor solutions. The successful portfolio accelerates the market for automotive, industrial, infrastructure and iot applications, empowering billions of connected smart devices to improve the way people work and live.