Independent research and development, the world's first! A new generation of C2W&W2W hybrid bonding equipment is about to be released!
Date：May 28, 2025 Views：23
Source: Green grain
As semiconductor processes approach the 1nm physical limit, the continuation of Moore's Law faces great challenges. The industry urgently needs to find new breakthroughs through the two paths of "More Moore" and "More than Moore". Whether it is 3D stacking technology to improve the integration density, or heterogeneous chip integration to expand the functional boundary, hybrid bonding technology has become an irreplaceable core technology. However, the traditional technology route has long faced a difficult choice between W2W (wafer to wafer) and C2W (chip to wafer) : W2W pursues extreme efficiency but has high yield risk, and C2W is flexible and innovative but has low mass production efficiency.
On March 11, witness a new milestone in semiconductor bonding technology!
SAB 82CWW series will break the technical boundary of W2W and C2W, opening a new era of "dual mode parallel"! This device not only solves the "two choices one" dilemma faced by the industry for a long time, but also injects strong momentum into AI chips, HBM storage, Micro-LED display, 3D NAND and other fields with ultra-high precision, intelligent process and efficient production capacity, enabling future scientific and technological development!
Disruptive innovation, coming soon!
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