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Honda (Honda) and Renesas have signed an agreement to jointly develop high-performance SOCs for software-defined vehicles
Date:January 20, 2025    Views:54

Source: Renesas Electronics Author: Renesas Electronics
    Tokyo, Japan, January 8, 2025 - Honda Kiken Industrial Co., LTD. (TSE: 7267) and Renesas Electronics Co., LTD. (TSE: 6723) today announced that they have signed an agreement to develop high-performance system-on-chip (SoC) for software-defined vehicles (SDVS). The new SoC, designed to deliver 2000 TOPS leading AI performance and 20TOPS/W superior power efficiency, is planned for future models of Honda's new electric vehicle (EV) family: the "Honda Zero Series," specifically for models that will be launched in the late 2020s. The agreement was announced at Honda's CES 2025 press conference in Las Vegas, Nevada, USA on January 7.

Pictured: Honda Senior Managing Executive Officer, Katsushi Inoue (left), Renesas SVP Vivek Bhan (right)
    Honda is developing an original SDV to provide an optimized mobility experience for every customer in the Honda 0 Series. The Honda 0 Series will feature a centralized E/E architecture that combines multiple electronic control units (ECUs) responsible for controlling vehicle functions into a single ECU. The core ECU is the "heart" of the SDV and is responsible for managing basic vehicle operations such as Advanced driver assistance systems (ADAS), autonomous driving (AD), powertrain control, and comfort functions, all of which are performed efficiently on a single ECU. To achieve this, ECUs need to be equipped with an SoC that not only delivers processing performance far beyond that of traditional systems, but also minimizes the increase in power consumption.
    Renesas is committed to providing automotive semiconductor solutions to help automotive Oems develop SDVS. Renesas' R-Car solution utilizes multi-die chiplet technology (note 3) and integrates AI accelerators (Note 4) into its SOCs, providing increased AI performance and customization capabilities.
    To realize Honda's vision for the SDV, Honda has entered into an agreement with Renesas to jointly develop a high-performance SoC computing solution designed specifically for the core ECU. The SoC uses TSMC's leading 3-nanometer automotive process technology to significantly reduce power consumption. In addition, it implements a system utilizing multi-die chiplet technology that combines Renesas' General-purpose fifth-generation (Gen 5) R-Car X5 SoC family with an AI accelerator optimized for AI software developed independently by Honda. Through this combination, the system aims to achieve industry-leading AI performance and energy efficiency. SoC chip solutions will deliver the AI performance required for advanced functions such as AD while maintaining low power consumption. Chiplet technology allows the flexibility to create custom solutions and offers future upgrades to improve functionality and performance.
    Honda and Renesas have worked closely together for years. The agreement will accelerate the integration of advanced semiconductor and software innovations into the Honda 0 Series, enhancing the customer travel experience.



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