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X-FAB introduces embedded data storage solutions based on its 110nm vehicle gauge BCD-on-SOI technology
Date:December 15, 2024    Views:114

Source: X-FAB Author: X-FAB
    Beijing, China, December 5, 2024 - X-FAB Silicon Foundries (" X-FAB "), a globally recognized analog/mixed-signal foundry of excellence, today announced a major innovation in non-volatile storage. The innovation leverages X-FAB's best-in-class SONOS technology: Based on its high-voltage BCD-on-SOI XT011, a 110nm process node platform, X-FAB offers customers an AECQ100 Grade-0 compliant 32kByte capacity embedded flash IP with an additional 4Kbit EEPROM. In addition, from 2025, X-FAB also plans to introduce larger capacity 64KByte, 128KByte flash memory and EEPROM with larger storage space.

    By adopting a unique approach, both flash memory and EEPROM elements are placed in a single macro unit and share the necessary control circuitry. This means a simpler layout that reduces the overall footprint of the combined components and sets a new industry benchmark for 32KBytes storage solutions that support Grade-0, 175°C.
    The embedded flash provides customers with the most advanced data access capability on the market, with the ability to read data over the entire -40°C to 175°C temperature range, while the EEPROM can also write data at temperatures up to 175°C. EEPROM is suitable for applications that require frequent data writing to improve the durability and flexibility of flash memory. It can also effectively act as a cache, programming data to EEPROM when operating conditions are not suitable for writing to flash memory, and then writing to flash memory when the temperature drops below 125°C. Thanks to excellent robustness, continuous data storage integrity and significant space savings, the IP is designed to meet the needs of automotive, medical and industrial applications.
    The new NVM combination IP uses a 64-bit bus, 8-bit ECC for the flash component, and 14-bit ECC for the EEPROM component, which enables zero-ppm error performance for devices deployed with this integrated IP. Dedicated circuits for easy access to memory and DFT dramatically reduce test times and minimize associated costs. X-FAB can also provide BIST modules and test services if required.


X-FAB French clean Room
    "With this new NVM IP using our proprietary SONOS technology, X-FAB achieves the highest level of reliability. This IP will provide best-in-class data retention and temperature stability for our customers' embedded systems." "By integrating two different NVM components, flash and EEPROM, into a single macro unit, we can now build an embedded data storage solution that can handle the most demanding working situations," said Thomas Ramsch, Director of NVM development at X-FAB.
    "With a smaller footprint and faster access speed, our NVM portfolio IP will play a key role in the development of high logic-density applications." Nando Basile, technical marketing Manager for NVM Solutions at X-FAB, added, "This will enable the next generation of smart sensor and actuator CPU system designs to have a broader range of capabilities, whether on mature CPU architectures such as ARM or RISC-V, or in customers' proprietary designs."

    Abbreviations:
    BCD bipolar-CMOS-DMOS: Bipolar transistor - complementary metal oxide semiconductor - double diffused metal oxide semiconductor
    NVM Non-Volatile-Memory: non-volatile storage
    BIST Build-In Self-Test: built-in self-test
    DFT Design for Testability: Design for testability
    ECC Error Checking and Correcting: ECC error checking and correcting
   EEPROM Live erasable programmable read-only memory
   Parts per million
   Silicon on SOI insulator
    SONOS Silicon Oxide Nitride Oxide Silicon. Sonos Silicon oxide nitride oxide silicon


About X-FAB:

    X-FAB is a global foundry group that provides comprehensive technical expertise and design IP to help customers develop world-leading semiconductor products, which are manufactured at X-FAB's six manufacturing sites in Malaysia, Germany, France and the United States. Primarily serving end markets such as automotive, industrial and medical, X-FAB has exceptional expertise in analog/mixed-signal technology, Microsystems/micro-electro-mechanical systems (MEMS) and silicon carbide (SiC), making it the ideal development and manufacturing partner for our customers. X-FAB has been listed on Euronext Paris since April 2017 (ticker symbol: XFAB) and currently employs around 4,500 people.





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