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Morse Microelectronics announced that the award-winning MM8108 Wi-Fi HaLow system-on-chip, module, evaluation kit and HaLowLink 2 have officially entered mass production
Date:November 17, 2025    Views:29

Source: Morse Microelectronics' global supply of development boards and next-generation evaluation platforms will disrupt the landscape of the Internet of Things
    Beijing, China, Sydney, Australia (and The Things Conference in Amsterdam) - September 24, 2025 - Morse Microelectronics, a global leader in Wi-Fi HaLow chip solutions, announced today The second-generation MM8108 system-on-chip (SoC) has entered large-scale mass production and is now fully available on the market. This milestone marks a major leap in Wi-Fi HaLow technology, providing unparalleled data throughput over long distances, thereby empowering the development of next-generation Internet of Things (IoT) and Edge AI solutions.


Mass production and full-scale market launch
    The MM8108 Wi-Fi HaLow SoC can achieve a data rate of up to 43Mbps over long distances and is now in full mass production. This milestone breakthrough has laid the foundation for a new generation of long-range, low-power Internet of Things devices. With the full-scale launch of chips, Morse Microelectronics has simultaneously introduced multiple evaluation kits (EVKs) :
    Mm8108-ekh01: Integrate Morse Microelectronics MM8108 SoC with Broadcom BCM2711 SoC on the Raspberry Pi 4 platform based on Linux

     Mm8108-ekh05: Integrates Morse Microelectronics' MM8108 SoC with stmicroelectronics' STM32U585 on a FreerTos-based Internet of Things platform

    Mm8108-ekh19: Integrates the Moore Microelectronics MM8108 SoC onto a USB-A network card, which is equipped with a GLi.net GL-MT3000 router featuring Mediatek MT7981B Wi-Fi 6 SoC

    Currently, these kits are now being shipped globally through Mouser Electronics, providing strong support for developers to design and deliver Wi-Fi Halow-based Internet of Things 2.0 solutions。


Module supply situation
    With the MM8108 entering mass production, the supporting modules are also rapidly increasing in output to meet the growing customer demands. The MM8108-MF15457 reference module from Morse Microelectronics is now available for public sale on Mouser.com. The AW-HM677 module of AzureWave has been directly supplied to large-scale customers by AzureWave. Vantron's VT-MOB-AH-8108 module can now support the demands of small and medium batch customers and is scheduled to enter full mass production this year.    Meanwhile, Quectel's modules are also scheduled to enter mass production this year. These diverse options can ensure that developers and Oems integrate Wi-Fi HaLow through multiple channels and accelerate product launches.
    Patrick Lin, Vice President of Product Marketing at Haihua Technology, said: "Our collaboration with Morse Microelectronics on the MM8108 chip provides customers with a way to use the performance and reliability of Wi-Fi HaLow on a large scale." By providing modules based on MM8108, we are helping Oems shorten the development cycle and confidently launch the next-generation long-range, low-power iot solutions.

Expand the assessment of the ecosystem using HaLowLink 2
    For this product launch, Morse Microelectronics also introduced the next-generation evaluation platform HaLowLink 2. Based on the successful experience of HaLowLink 1, this new platform upgrades the core Wi-Fi HaLow SoC from MM6108 to MM8108. With the 256QAM modulation technology and 26dBm built-in power amplifier of the MM8108 chip, it achieves a throughput of 43Mbps over a greater distance.

    HaLowLink 2 is scheduled to be launched in the first quarter of 2026 in the United States, the European Union, the United Kingdom, Canada, Japan and Australia.
    The HaLowLink 2 platform is designed to accelerate and simplify the application of Wi-Fi HaLow, providing a powerful reference design that simplifies the evaluation, prototyping and deployment processes of Wi-Fi HaLow networks.
    Michael De Nil, co-founder and CEO of Morse Microelectronics, said: "The MM8108 chip and its rapidly expanding ecosystem mark a breakthrough moment in the field of the Internet of Things." Through Wi-Fi HaLow technology, we not only provide chips, but also lay the foundation for Internet of Things 2.0 (oT 2.0) I - an era where billions of devices can be seamlessly and reliably connected, with unprecedented throughput and coverage. This will prompt cities, industries and families to rethink the possibilities of connection, and change the way people monitor, automate and interact with the world around them. What is being initiated at this moment is precisely the new starting point that defines the development and innovation wave of the Internet of Things in the next decade.
    For more information, technical documentation or to make a purchase, visit www.morsemicro.com/zh-hans or search for MM8108-EKH01, MM8108-EKH05 and MM8108-EKH19 on Mouser.com.

About Morse Microelectronics
    Morse Microelectronics is a leading fabless semiconductor company specializing in Wi-Fi HaLow technology, revolutionizing iot connectivity with its award-winning technology. The company's cutting-edge MM6108 and newly launched MM8108 chips offer the market the fastest, smallest in size, lowest in power consumption and longest transmission distance Wi-Fi HaLow connection.
    Morse Microelectronics' Wi-Fi HaLow technology is booming worldwide, enabling the transmission distance of connected devices to reach 10 times that of traditional Wi-Fi networks and the coverage area to reach 100 times that of traditional Wi-Fi networks. This breakthrough is profoundly transforming the Internet of Things (iot) connections in numerous fields such as smart homes, industrial automation, and smart cities.
    For details, please visit our website: https://www.morsemicro.com/zh-hans





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