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ChipSourceTek-CST6115 supports single-channel H-bridge drive, featuring low-power sleep mode, PWM speed regulation and protection mechanism, making it suitable for low-power scenarios such as electronic locks and robots.
Date:December 9, 2025    Views:10

+───────○ VM (2.5-12V) │ │ ┌──┴──┐ │ │ 10μF│ │ └──┬──┘ │ │ │ ┌────┴────┐ │ IN1 ○─┤ IN1 ├──┐ IN2 ○─┤ IN2 │ │ ┌───────┐ GND ○─┤ GND │ ├──┤MOTOR ├─○ Motor │ │ CST6115│ │ └───────┘ │ │ OUT1 ├──┘ └─┤ OUT2 │ └────────┘
  • Key design points‌:
    • Youdaoplaceholder0 power filter:A 10μF+0.1μF capacitor is connected in parallel nearby the VM pin to suppress voltage fluctuations.
    • ‌‌Motor freewheeling current:If driving inductive loads (such as motors), parallel Schottky diodes (such as 1N5819) between OUT1 and OUT2.
    • Control signal ‌:IN1/IN2 can be directly connected to the MCU GPIO (supporting 3.3V/5V logic levels).

3. Pin Inference Description (SOP8 package)

⚠️ ‌Note: ‌:The official has not provided the pin diagram. Based on the industry standard SOP8 motor drive packaging, it is speculated that:
| Pin number | Name | Function description |
|--------|-------|--------------------------|
| 1 | VM | Motor power input(2.5-12V) |
| 2 | OUT1 | H-bridge output1(Connect to the motor end) |
| 3 | GND | Grounding |
| 4 | IN1 | Control input1(PWM/Logic) |
| 5 | IN2 | Control input2(PWM/Logic) |
| 6 | NC | Not connected |
| 7 | OUT2 | H-bridge output2(Connect to the motor end) |
| 8 | VCC | Logic power supply(Optional. By default, it connects to the VM)|


4. Selection and mass production information

  • Model‌:ChipSourceTek-CST6115S
  • Encapsulation ‌:SOP8
  • Packaging‌:Reel packaging, 4000 pieces per roll
  • Mark‌:CST-LOGO: CST6115 TXX.XX(Batch code)

5.Suggestions for optimizing application scenarios

  • Electronic lock/robot ‌:Reduce standby power consumption by using sleep mode and achieve precise position control through PWM.
  • Toys/digital products‌:Dual H-bridges in parallel (two ChipSourceTek-CST6115 chips) drive the stepper motor, simplifying the structure.
  • Heat dissipation design ‌:When laying out the PCB, the SOP8 heat sink should be connected to a large area of copper (connected to GND) to enhance heat dissipation.

It is recommended to refer to the official data sheet to verify the pin and circuit details. If further design support is needed (such as the configuration of the stepper motor drive), specific application parameters can be provided for in-depth analysis.

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